New file format facilitates data exchange of compact thermal models throughout electronics industry

PITTSBURGH—A new open neutral file format developed by ANSYS is reported to enable electronic component manufacturers and their customers to easily share design models between different thermal simulation toolsets. The open model format is intended to promote interoperability and ease the exchange of data throughout the supply chain, thereby saving time, reducing import errors, and improving accuracy.

Thermal analysis is critical for new designs in the electronics industry, making it more important for suppliers and customers to exchange information and models. The release of a standard file format enables component suppliers to create a single compact model file to describe its thermal characteristics that work with any simulation software tool that adheres to the standard, ANSYS said in a press release.

ANSYS (https://www.ansys.com/) collaborated with several companies, led by Intel, to develop thermal model exchange standards that would facilitate easy data exchange and consolidate the many different file formats currently being used. The companies validated that the file exchange format met the necessary criteria and have endorsed the ANSYS open neutral file format standard.

“Thermal engineers at Intel support this collaborative effort to enable a direct method of tool interoperability and multi-disciplinary simulation,” said David Ochoa, data center platform applications engineer, Intel, in the release. ”Productivity is expected to increase with automation and custom tools that will be directly compatible with commercial software via this standard. Intel’s customer support for thermal simulation will be simplified and streamlined since we can provide customers a single format rather than spend time developing, validating, and supporting multiple types.”

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