Materion’s QMet 300 alloy reportedly allows design engineers to create smaller high-current and high-heat transfer components to fit into tighter spaces.
MAYFIELD HEIGHTS, Ohio—Materion Corporation recently introduced QMet™ 300 alloy, a high-performance strip alloy that is said to offer a unique combination of high conductivity, strength, and formability to meet current and emerging customer needs in the consumer electronics and automotive markets.
QMet 300 strip alloy is described by Materion as a copper-chromium-silver material with conductivity greater than all other alloys of similar strength. It is also said to offer sharp formability and stress relaxation resistance comparable to that of copper beryllium.
“We created QMet 300 strip alloy to enable new designs that have been unachievable for customers across a range of markets and applications,” said Clive Grannum, president of Materion Performance Alloys and Composites, in a company release. “Its high conductivity, strength, and formability set it apart from other alloys available in the marketplace. We expect it will be used to solve materials problems in an even wider range of industries than those currently identified, including the appliance and server and data connections markets.”
The high conductivity of QMet 300 alloy is said to allow design engineers to create smaller high-current and high-heat transfer components to fit into tighter spaces, making it suitable for numerous consumer electronics and automotive applications, including electric vehicle (EV) charging contacts; appliance power contacts; computer power contacts; and backplane, midplane, and card edge connectors. The alloy is also reported to be well-suited for use in photovoltaic system connectors; heat spreading for consumer electronics; and automotive wire harness terminals and high voltage connectors.
Materion Corporation (http://materion.com/About), headquartered in Mayfield Heights, Ohio, supplies advanced materials to global markets through its wholly owned subsidiaries.