MINNEAPOLIS—CyberOptics® Corporation recently introduced its new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics. The 300mm Auto Resistance Sensor (ARS) with CyberSpectrum software enables real-time resistance measurements of plating cell contacts in semiconductor electrochemical deposition (ECD) applications.
According to CyberOptics, the ARS quickly identifies and monitors resistance measurements with 50 separate pads around the perimeter, using a Kelvin Sensing (4-wire resistance) method to detect residue affecting plating pins. Process and equipment engineers in semiconductor fabs can predict when a tool needs maintenance with quantitative analysis of measured mean resistance over time. They can also shorten equipment maintenance cycles and improve cell-to-cell uniformity with the wafer-like, 4-wire resistance sensor and CyberSpectrum software’s objective and repeatable data, the company said.
“We have extended our proprietary line of WaferSense devices that are used by semiconductor fabs and equipment OEMs worldwide to significantly improve yields and tool uptime,” said Dr. Subodh Kulkarni, president and CEO, CyberOptics, in a release from the company. “The new ARS can wirelessly capture and monitor real-time resistance measurements for the Electrochemical Deposition application in semiconductor fabs. Similar to our other WaferSense devices, it can also save time, expense, and improve processes.”
CyberOptics Corporation (www.cyberoptics.com) is a global developer and manufacturer of high-precision 3D sensing technology products. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity.