Molded ceramic packaging from StratEdge. (StratEdge photo)

SANTEE, Calif.—Molded ceramic packages from StratEdge Corporation’s off-the-shelf line can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices, the company said in a release.

StratEdge designs and produces high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices. Its molded ceramic packages are said to be available in more than 200 standard outlines, dramatically increasing the packaging options for GaN devices. StratEdge also offers complete automated assembly and test services for these packages, including gold-tin solder die attach, according to the release.

Gallium nitride devices are traditionally packaged in StratEdge’s LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC. These packages accommodate frequencies up to 63GHz. In the molded ceramic package, the standard ASTM F15 alloy base can be replaced with CMC, the company said in the release.

For frequencies of 18 GHz or less, a molded ceramic package provides hermeticity, a broad array of outline packages, and lower cost, according to StratEdge, while the CMC provides the heat dissipation needed for GaN devices to meet requirements for aerospace applications. For surface mount technology (SMT) applications, the packages can be manufactured with gull-wing formed leads. They offer flexibility because it’s inexpensive to change the lead design to match an existing footprint, the company said.

“Molded ceramic packages provide a straightforward solution to challenging requirements for packaging GaN devices used in military and space applications,” said Casey Krawiec, vice president of global sales for StratEdge, in the release. “When sealed with metal lids using gold-tin solder, Mil-Std fine and gross leak hermeticity is met and the atmosphere within the sealed package can be controlled. Molded ceramic packages offer flexibility to our customers with complex GaN packaging needs.”

StratEdge Corporation (www.stratedge.com) operates an ITAR registered and ISO 9001:2015 certified facility in Santee, California, near San Diego. The company, founded in 1992, designs, manufactures, and provides assembly services for a line of high-frequency and high-power semiconductor packages, operating from DC to 63+ GHz.

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