LANSDALE, Pa.—A new Bonded Slit Valve (BSV) Door manufactured by Greene Tweed is reported to increase life expectancy and improve seal performance for demanding semiconductor processing applications.
Made from Chemraz®, Greene Tweed’s proprietary perfluoroelastomer (FFKM) compound, or other customer-requested elastomers, the seal is said to better withstand dynamic use for longer life and leak elimination. Seal integrity is further enhanced by a design that fills the gland and avoids traditional molded parting lines, according to a release from Greene Tweed.
Greene Tweed is a global manufacturer of high-performance sealing products and engineered components. The company introduced the BSV Door in 1997 and now supplies BSV Doors to numerous semiconductor manufacturers, for both 200-mm and 300-mm tools.
The bonded-gate design of the new BSV Door can provide up to a ten-fold increase in seal life during wafer production, the manufacturer said in the release. The design is also said to minimize abrasion, thereby reducing particulation and contamination.
Greene Tweed said its BSV Door is also much easier to maintain. In the past, when O-ring replacement was the only option, cleaning the gland and installing a new O-ring was difficult. Now, installation requires only removing and replacing a few bolts when replacing the complete BSV Door assembly, the company said.
To meet customers’ challenging requirements, Greene Tweed said it leverages core capabilities in anodizing, electropolishing, nickel plating, special cleaning, and leak testing.