Ansys’s new technology is said to help engineers improve product design for advanced applications ranging from autonomous vehicles to 5G communications

PITTSBURGH—Ansys reported that it is helping engineering teams to mesh and solve larger designs with the launch of Ansys HFSS Mesh Fusion. The new feature can cut development expenses while driving “rapid and fully coupled simulation of complex EM systems—without compromising the design or fidelity,” the company said in a release.

Modern electronic products are more sophisticated than ever, with higher density, lower voltage margins, and more advanced processes. To deliver innovation, engineers must increase functionality and maintain or even decrease power consumption within a smaller form factor.

As these designs become more challenging, engineers must solve complex interactions between components and across systems, critical for designing applications for cutting-edge artificial intelligence machine learning, autonomous vehicles, 5G communications, high-performance computing, and the industrial internet of things (IIoT), according to the release.

HFSS Mesh Fusion, available in Ansys HFSS 2021 R1, helps engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas, and platform in a single Ansys HFSS analysis to predict EM interactions. HFSS Mesh Fusion bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters, or within Ansys® Cloud™. A solver technology then extracts a fully coupled, uncompromised, full-wave EM matrix. By enabling much more complex designs to be solved, companies can confidently push the limits of performance to create state-of-the-art products, Ansys said in the release.

“Increasing levels of electronic system integration are leading to a greater demand for comprehensive EM system analysis,” said Sangyun Kim, vice president, Foundry Design Technology Team at Samsung Electronics, in the release. “Ansys HFSS Mesh Fusion makes it possible for our talented engineering teams to create optimal designs, shrink design cycles and cost, and increase the value that we deliver to our customers. Leveraging Mesh Fusion, we are innovating highly advanced designs that were previously unimaginable. In fact, for the customer’s latest flat panel TV, we simulated the EM transmission of an entire room.”

HFSS Mesh Fusion is said to help engineers “swiftly overcome the most challenging design obstacles to deliver best-in-class products to customers.”

“Ansys HFSS can solve any structure, regardless of complexity, enabling creative out-of-the-box designs,” said Clyde Callewaert, senior engineer at Herrick Technology Labs, in the release. “The new HFSS Mesh Fusion technology will allow us to tackle even more comprehensive, uncompromised simulations with HFSS, further validating it as our ‘virtual laboratory’. Because with HFSS in the loop, we go into the lab to confirm results, not discover them.”

By solving the most complex EM models, HFSS Mesh Fusion delivers critical design data that improves end products, according to Ansys.

“HFSS Mesh Fusion helps IC designers effectively manage the capacity, complexity, dimensional range, and density of geometric detail in a fully coupled EM simulation,” said John Lee, vice president and general manager at Ansys, in the release. “This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence, and deliver trailblazing products with more functionality than ever thought possible. This supports numerous highly sophisticated applications, including 5G communications, autonomous driving, and many more.”

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