SAN JOSE, Calif.—Electronic design firm Cadence Design Systems, Inc., recently introduced what is reported to be the industry’s first engineering platform for system design that unifies schematic, layout, analysis, design collaboration, and data management.
The Cadence® Allegro® X Design Platform streamlines the system design process for engineers, offering extensive collaboration across all engineering disciplines. It also provides integration with best-in-class Cadence signoff-level simulation and analysis products, and greater layout performance, Cadence said in a release.
Engineers today increasingly must design and collaborate across multiple domains, including electromagnetic (EM), thermal, signal and power integrity (SI/PI), and logical/physical implementation. The Allegro X platform offers a simplified user interaction model that is said to provide quick technology access and immediate value for novice and expert users.
The platform minimizes iterations and provides access to the logical and physical domains simultaneously with concurrent collaboration capabilities across schematic, layout, and analysis activities. In this way, the Allegro X platform reduces the time and effort to complete the design of complex systems by up to four times versus legacy design tools, the company said.
The Allegro X platform is reported to boost design throughput and performance in multiple ways. By leveraging GPU technology in combination with core architectural optimization, Allegro X can accelerate performance across a wide range of operations.
“Harnessing the power of accelerated computing by using NVIDIA GPUs enables Cadence’s Allegro X platform to boost performance up to 20X for interactive operations,” said Greg Bodi, director of PCB layout engineering at NVIDIA, in the release. “This performance improvement delivers our engineers immediate canvas responsiveness and acceleration when 2D rendering complex boards during the design phase.”
Allegro X also uses cloud resources to synthesize full or partial PCB designs. Innovative machine learning (ML) techniques concurrently optimize the design for manufacturing, SI, and PI requirements while designing the power delivery network (PDN), device placement, and signal interconnect as specified by the system architect/electrical engineer, according to Cadence.
“The Allegro X platform establishes a unified engineering platform, boosting overall design team productivity up to 4X,” said Tom Beckley, senior vice president and general manager of the Custom IC and PCB Group at Cadence, in the release. “Engineers now have a framework for logical and physical design, in 2D or 3D, single- or multi-board, that allows them to optimize resources even on the most complex 5G designs, enabled by interoperability with the AWR Microwave Office RF design flow. Cadence R&D has been working diligently with academia and industry partners on groundbreaking, analysis-driven PCB synthesis that significantly enhances design productivity.”
Tomas Palacios, Ph.D., professor of electrical engineering and computer science at MIT, also weighed in on the platform.
“Multi-objective optimization is a challenging problem and I am pleased that MIT students and alumni have made significant progress working inside Cadence on novel ML solutions towards the synthesis of difficult PCB designs,” Palacios said in the release. “The resulting system will not only benefit MIT, but will also significantly improve productivity in the PCB community at large.”
Cadence’s customers develop electronic products—from chips to boards to systems—for dynamic market applications that include consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial, and healthcare.