Semiconductor packaging examples showing printed 3D interconnects for 3D stacked die (left), mmWave (center), and flex circuit (right). (Graphic: Business Wire)

An electronic systems manufacturer is using Aerosol Jet for advanced 3D semiconductor packaging

 ALBUQUERQUE, N.M.—Optomec Inc., a privately-held supplier of additive manufacturing systems, reported that a leading global manufacturer of electronic systems recently purchased five more of its Aerosol Jet 3D Electronics Printers. The long-time customer has been using Optomec’s patented Aerosol Jet 3D Printed Electronics technology in production since 2018 for advanced semiconductor packaging applications in a proprietary mobile device end-product, Optomec said in a release.

The order, reported to exceed $1 million, increases the customer’s total of these printers to 15. It is part of a production ramp plan that will grow to more than 25 systems over the next 12 months, according to the release.

“This most recent multi-system 3D Additive Electronics order is further testimony to the production viability of Optomec’s solutions,” said David Ramahi, Optomec CEO, in the release. “We look forward to supporting this industry-leading user as they continue to grow their fleet of production systems, and likewise replicating this proof statement with others in need of next-generation semiconductor packaging solutions.”

According to Optomec, its Aerosol Jet 3D Electronics Printers are an additive electronics technology that is uniquely capable of directly printing high-resolution conductive circuitry, with feature sizes as small as 10 microns. The process is further differentiated by its ability to print onto non-planar substrates and fully 3-dimensional end-parts. Production applications include direct printing of 3D antennas, 3D sensors, medical electronics, semiconductor packaging, and display assembly, the company said in the release.

A primary high-value use case in semiconductor packaging is the printing of 3D interconnects to connect chips to other chips and traditional circuit boards, or even to directly integrate chips into end-products, such as wearables. In this case, the process replaces legacy wire-bonding due to its advantages of smaller space claim, lower loss (especially in high frequency and mmWave), and greater mechanical reliability.

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