November 17, 2021
DALLAS—Texas Instruments Incorporated (TI) is planning to begin construction in 2022 on its new 300-millimeter semiconductor wafer fabrication plants (fabs) in Sherman, Texas. The company is aiming to extend its cost advantage and provide greater control of its supply chain by investing in long-term manufacturing capacity, TI said in a press release.
Demand for semiconductors in electronics is expected to continue to grow well into the future, and TI’s plans to expand its capacity are well-aligned with this expectation. The North Texas site in Sherman has the potential to accommodate up to four fabs to meet semiconductor demand over time. Texas Instruments plans to start construction of the first and second fabs in 2022, the company said.
“TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers’ demand in the coming decades,” said Rich Templeton, TI’s chairman, president, and CEO, in the release. “Our commitment to North Texas spans more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community.”
Production from the first new fab is expected as early as 2025. The option to include up to four fabs means that total investment potential at the site could reach approximately $30 billion and support 3,000 direct jobs over time, the company said.
The new fabs will complement TI’s existing 300-mm fabs, which include DMOS6, in Dallas, and RFAB1 and the soon-to-be-completed RFAB2, both in Richardson, Texas. The RFAB2 fab is expected to start production in the second half of 2022. Texas Instruments also said that its recently acquired LFAB plant in Lehi, Utah, is expected to begin production in early 2023.
Texas Instruments Incorporated is a global semiconductor company that designs, manufactures, tests, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment, and enterprise systems.