X2F adds rotary table to enhance its plastics molding process
March 2, 2022
LOVELAND, Colo.—A plastics processing technology developed by X2F combines controlled viscosity with a patented mold-filling process to create high-value components. The process uses advanced materials traditionally thought to be impossible to mold, achieving complex product geometries with improved operational efficiencies, according to X2F. Among the applications initially targeted are polymer-based optics with improved properties, overmolding of delicate electronics and circuitry, and highly-filled engineering resins.
In a recent enhancement to its molding process, X2F added a rotary table that reduces cycle times and opens up higher-volume production for its controlled viscosity molding machine. According to the release, the rotary table enables X2F to achieve production volumes of up to 4 million parts per year—depending on the cycle time—for the manufacture of critical components for the electronics, automotive, industrial, and medical markets.
“Our technology enables the manufacture of previously impossible-to-mold thermoplastic parts that provide step-change improvements in thermal conductivity, EMI shielding, and high-temperature capability in electronics,” said Michael Slowik, CEO of X2F, in a release. “Key applications in electric vehicle batteries, metaverse hardware, and mobile phones are driving customer engagement.”
X2F said in the release that its new molding technology enables manufacturing of complex product designs using previously “un-moldable” materials, from prototyping to production-scale. The controlled viscosity process is reported to significantly reduce the material degradation and molded-in stress inherent in today’s conventional molding technologies. It also permits the use of greater amounts of filler and additives than are currently possible, the company said, allowing for parts that are stronger and more complex, with advanced material properties.
For automotive lighting applications, X2F said it can produce complex geometries, thicker lenses, and larger shapes. For encapsulated electronics, the technology allows for new materials with advanced properties, fewer production steps, dramatically improved yields, and shorter cycle times. For highly-filled resins like polyetheretherketone (PEEK), the process permits increased glass or carbon fiber loadings that can improve strength and stiffness by 20 percent, the company said.