Category: Electronic Components

Smith Metal Products specializes in metal injection molding (MIM) of soft metal alloys and other metals for small electronic and electrical components

The new equipment and capabilities will position REDCOM EMS to meet the demands of current and future customers

Sensera Inc. (MicroDevices) has expanded its capabilities to include precision fiber optic assemblies

The three systems include a Hesse Bondjet 820 and two Mycronic MRSI 705 systems

Astronics Corporation recently released its new ME1000 family of mPCIe avionics interface cards for embedded aerospace applications.

Optomec reported that Samsung Electronics has commissioned an Aerosol Jet 5X System in its Printed Electronics Lab to enable production of next-generation electronics

The acquisition adds capabilities to design and manufacture custom electronic assemblies

Private equity firm acquires an electronics contract manufacturer specializing in design and manufacture of highly complex electronic and RF circuit cards and assemblies

Maxim Integrated Products’ MAX77860 is reported to reduce complexity and simplify software development

Designed into Fujitsu’s Raku Raku Smartphone F-01L, the MAX30101 enables users to measure stress levels and arterial aging

A reader that works with a hydrogel sensor injected under the skin was developed in four months at NextFlex facility in San Jose

Cornell Dubilier Electronics (CDE) announced the availability of its Type RA multilayered film capacitors for operation at 125°C.