FREUDENSTADT, Germany—American printed circuit board manufacturer Calumet Electronics is working collaboratively with Schmid Group to develop, onshore, and scale U.S. production capacity for advanced substrates, according to a release from Schmid Group.

Calumet Electronics is a “commercial and non-traditional defense contractor specializing in the research, design, engineering, and manufacturing of high-quality printed circuit boards and, more recently, organic substrates,” according to the company’s website. Schmid Group is a developer of customized equipment and processes for the high-tech electronic, photovoltaics, glass, and energy systems industries.

The collaboration between the two companies, described as a significant step in advancing substrate technology within the United States, complements the recent government grant awarded to Calumet by the U.S. Department of Defense under DPA Title III. Schmid is providing innovative equipment, while Calumet is taking the lead in expanding its manufacturing capabilities. Together, they are aligning their efforts with construction milestones to establish the first-ever U.S.-based advanced substrate facility, according to the release.

“The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States’ competitive position in the global market,” said Calumet Electronics President and Chief Executive Officer Stephen Vairo, in a statement.

A dedicated U.S.-based advanced technologies facility

Calumet is currently standing up a 60,000-square-foot state-of-the-art manufacturing facility dedicated to advanced substrate production. The project will implement cutting-edge process and production technology, enabling the production of mSAP, SAP, and (ET) embedded trace on a single versatile platform. Calumet and Schmid’s R&D teams are collaborating across enterprises to develop what they call “a modular, space-efficient approach that maximizes environmental conservation, process efficiency, and cost savings while minimizing costly cleanroom footprints.”

According to the release, the project is projected to attract a total capital investment of nearly $50 million, underscoring the dedication to strengthening the U.S. supply chain for microelectronics and printed circuit boards.

Calumet received a significant investment from the U.S. Department of Defense, which awarded the company $39.9 million via the DPA Title III Program. The grant empowers Calumet, in collaboration with Schmid, to enhance manufacturing capabilities and contribute to national security.

Advanced packaging and substrates are driving advancements in miniaturization, integration, performance, thermal management, high frequency capabilities, speed, and energy efficient components and systems. Engineered to cater to the specific requirements of high-performance systems, advanced substrates play a pivotal role in enhancing functionality and efficiency.

In addition to driving technological advancements, the partnership between Calumet and Schmid is also focusing on upskilling the U.S. workforce. By establishing advanced packaging and substrate manufacturing within the United States, the collaboration creates sustainable jobs and strengthens domestic expertise, the companies said in the release.

“We are pleased to partner with Calumet to streamline the traditional lab-to-fab transition, in alignment with our shared mission as innovators and sustainable partners to the industry,” said Schmid Group Chief Executive Officer Christian Schmid, in the release. “We will create a lighthouse project in Calumet for the reshoring of technology and production to the U.S.”