May 29, 2025
MIT engineers developed ultrathin electronic films that sense heat and other signals, and could reduce the bulk of conventional goggles and scopes. By Jennifer Chu | MIT News CAMBRIDGE, Mass.—MIT engineers have developed a technique to grow and peel ultrathin “skins”...
May 29, 2025
COLORADO SPRINGS, Colo.—Frontgrade Technologies, a provider of high-reliability electronics for space and national security missions, recently acquired IDSI, LLC, the Defense Solutions division of Crescend Technologies, LLC. The acquisition aims to bolster...
May 29, 2025
MALIBU, Calif.—HRL Laboratories is working to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with a novel cooling system for stacks of microelectronic chips. The program, called PHased ARray with INnovative...
May 29, 2025
Preventing 3D integrated circuits from overheating is key to enabling their widespread use. By Kylie Foy | MIT Lincoln Laboratory CAMBRIDGE, Mass.—As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking...
May 29, 2025
Cadence is working to accommodate unprecedented AI processing demands. SAN JOSE, Calif.—Cadence Design Systems recently introduced what it described as “the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution on the TSMC N3 process.” The new system is...
