The first manufacturing facility on the Arizona campus is expected to be completed in mid-2027, with production beginning in early 2028.
TEMPE, Ariz.—Amkor Technology, Inc., in collaboration with the Trump administration, broke ground in October on its planned state-of-the-art, outsourced semiconductor advanced packaging and test campus in Peoria, Arizona. The company also announced it is planning to increase its investment in the facility to include additional cleanroom space and a second greenfield packaging and test facility.
According to a company release, the planned increase boosts the total project investment by more than $5 billion, to a total of $7 billion across two phases. Amkor, a prominent provider of semiconductor packaging and test services, said its investment supports the broader strategy to strengthen U.S. semiconductor leadership. Its planned facility will be “the first U.S. based high volume advanced packaging facility,” the company said in the release.
Upon completion of both phases, the campus will reportedly offer more than 750,000 square feet of cleanroom space and as many as 3,000 high-quality jobs. Construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production beginning in early 2028.
The new greenfield facilities will serve as a cornerstone of America’s advanced packaging capabilities, supporting key customers that include Apple and NVIDIA. Amkor said its expanded investment is supported by the Trump Administration’s CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and state and local governments.
“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Amkor President and Chief Executive Officer Giel Rutten, in a statement. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States. Arizona offers the right mix of talent, infrastructure, and industry presence, and we’re proud to deepen our roots here.”
Strategically located in Arizona’s growing high-tech corridor, the campus will house what the company described as “the most sophisticated outsourced semiconductor packaging and test facilities in the country.” It will feature smart factory technologies and scalable production lines to meet evolving market demands for AI, high performance computing, mobile communications, and automotive applications. The campus will focus on advanced packaging and testing technologies and will complement TSMC’s front-end wafer fabrication for full end-to-end semiconductor manufacturing, the release stated.
The groundbreaking ceremony brought together government officials, industry leaders, and community stakeholders to celebrate the milestone.
“President Trump’s leadership is bringing all stages of semiconductor manufacturing back to the United States,” said U.S. Secretary of Commerce, Howard Lutnick, in the release. “Our partnership with Amkor will bring high volume advanced packaging to the U.S. for the first time, supporting our leading AI industry capabilities and American innovation.”
“At Apple, we’re excited to help lead the creation of an end-to-end silicon supply chain in America,” said Sabih Khan, Apple’s chief operating officer, in a statement. “Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road. We’re proud to invest in Amkor through Apple’s American Manufacturing Program, which is a key part of our $600 billion commitment to create jobs and accelerate innovation right here in the U.S.”
“AI has ignited a new industrial revolution—and with it, the chance to reindustrialize America,” said NVIDIA Founder and CEO Jensen Huang, in the release. “Amkor’s new Arizona facility is a defining milestone in bringing this capability home. Together, we are rebuilding the supply chain—onshoring the AI technology stack that turns energy into intelligence and secures America’s leadership for the AI century.”
Amkor’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables.
“This new Amkor facility groundbreaking represents a testament to what is possible when industry leaders share a common vision and work together to build a resilient, end-to-end supply chain right here in the U.S.,” said Jun He, vice president, Advanced Packaging Technology and Service at TSMC, in the release. “Our collaboration in Arizona will provide customers with a streamlined, domestic ecosystem, designed to help define the future of local semiconductor manufacturing.”