New Chip Tests Cooling Solutions for Stacked Microelectronics

Preventing 3D integrated circuits from overheating is key to enabling their widespread use. By Kylie Foy | MIT Lincoln Laboratory CAMBRIDGE, Mass.—As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking...

New IP System Targets Need for Greater Memory Bandwidth

Cadence is working to accommodate unprecedented AI processing demands. SAN JOSE, Calif.—Cadence Design Systems recently introduced what it described as “the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution on the TSMC N3 process.” The new system is...

SADA Actuators Can Be Customized to Meet Specific Project Requirements

The single- and dual-axis actuators from ESI Motion are engineered to survive launch stresses and space operations, the company said. SIMI VALLEY, Calif.—A commercial-off-the-shelf SADA actuator from ESI Motion is engineered to meet the demanding requirements of...