WASHINGTON—The Department of Defense (DoD) announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation. The award will enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers, the DoD said in a release.

“The Biden Administration has prioritized the need to support and advance the domestic PrCB and advanced packaging industrial base,” said Laura Taylor-Kale, Ph.D., Assistant Secretary of Defense for Industrial Base Policy, in a statement. “These technologies are critical for modern weapons systems and will contribute to maintaining our warfighting edge over potential adversaries.”

The award will enable Calumet to scale up engineering, tooling, and manufacturing operations to establish domestic production capabilities for HDBU substrates. HDBU substrates and advanced packaging are critical enabling technologies for sixth generation systems and applications, including for radar, electronic warfare, processing, and communications. The place of performance is Calumet, Michigan.

To date, in calendar year 2023, the DPAI Program has made 22 awards, totaling $714 million. The program is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.

A version of this article originally appeared in DoD News.

Source: DoD News (https://www.defense.gov/News/Releases/Release/Article/3589418/dod-awards-399-million-to-strengthen-us-supply-chains-for-printed-circuit-boards/)