The cutting-edge cooling hardware, manufactured with Fabric8Labs’ proprietary ECAM process, is reported to provide superior thermal performance.
SAN DIEGO—Fabric8Labs is working to pioneer the next generation of manufacturing with its patented ECAM (Electrochemical Additive Manufacturing) 3D printing technology. Last fall, the company announced it was collaborating with cloud IT infrastructure provider Wiwynn to develop and showcase next-generation ECAM-enabled cold plates.
Wiwynn displayed the technology in October at OCP Global Summit 2025 in San Jose.
At Wiwynn’s booth, attendees saw a range of cutting-edge cold plates manufactured with Fabric8Labs’ proprietary ECAM process, according to a release from Fabric8Labs.
ECAM enables customized cooling solutions from direct-to-chip (DTC) single-phase to immersion cooling. (Image: Fabric8Labs/Business Wire)
Among the products featured were double-sided cold plates that are designed and parametrically optimized to extract heat from both sides of Future AI modules. Also on display were two-phase cold plates with advanced wicking structures developed by Fabric8Labs in collaboration with Wiwynn.
In addition, the Future Technologies Symposium featured a next-generation cold plate presentation with ECAM microchannels for ultra-high heat fluxes beyond 350W/cm².
“This joint effort highlights the transformative potential of Electrochemical Additive Manufacturing (ECAM), a process that enables the creation of complex, high-performance data center cooling hardware,” the release stated. “Fabric8Labs’ ECAM process unlocks new capabilities in thermal management design by manufacturing highly customized, complex geometries that are optimized to a chip’s unique power map. When integrated into the AI server’s cold plates, the technology delivers superior thermal performance that is essential for cooling the high-wattage GPUs and ASICs in modern AI data centers.”
The hardware displayed by Wiwynn is reported to highlight a significant leap in cooling technology that is driven by ECAM-enabled cold plates. These cold plates, optimized for AI and high-density workloads, provide the following benefits, according to the release:
Superior thermal performance: Enabling optimized fin structures that precisely direct coolant towards the chip’s hot spots, the cold plates are said to maximize cooling performance where it’s needed most, potentially resulting in a 5-8°C reduction in maximum chip temperature for high TDP devices.
Enhanced temperature uniformity: The ECAM cold plates, with a customized microchannel design precisely directing coolant flow, are said to significantly reduce temperature fluctuations. The result is a 200 percent improvement in temperature variance across the chip. This uniformity is crucial for maximizing chip performance and longevity.
Reduced total cost of ownership (TCO): By integrating best-in-class thermal performance and improved reliability, Wiwynn’s IT infrastructure enables lower operational costs for AI data centers through reduced spending on refrigeration and pumping power to move coolant.
“We are excited to collaborate with Wiwynn in demonstrating advanced cold plates for the most demanding AI workloads,” said Fabric8Labs Vice President of Product & Applications, Ian Winfield, in the release. “ECAM enables design and mass manufacturing of cooling solutions matched directly to the silicon power map—delivering efficiency, reliability, and performance beyond conventional approaches.”
A high-performance liquid cold plate design enabled by ECAM. (Image: Fabric8Labs/Business Wire)
Fabric8Labs, Inc., founded in 2015 and headquartered in San Diego, serves the electronics, medical devices, communications, and semiconductor industries. Its ECAM technology supports data center infrastructure, enabling advanced thermal management solutions, power management components, and semiconductor packaging. It is described as “a room-temperature metal additive manufacturing technology that leverages electroplating principles to create ultra-high resolution, three-dimensional metal parts without the need for expensive post-processing.”
The platform is used to build components rapidly at the atomic level, resulting in excellent feature resolution and surface finish.
“Addressing the thermal challenges of AI servers is a top priority for Wiwynn,” said Wiwynn Senior Director Lentis Pai, in the release. “With Fabric8Labs’ ECAM technology, we can realize our customized microchannel cold plate designs and pave the way for future direct‑to‑silicon cooling. This will enhance thermal performance, enabling data center customers to deploy the AI compute they need more efficiently.”
Wiwynn is a cloud IT infrastructure provider that offers high-quality computing, storage, and racks for data centers. The company stated that it invests heavily in “next-generation technologies to deliver TCO-optimized, workload-tuned, and energy-efficient solutions from cloud to edge.”
“Together, Fabric8Labs and Wiwynn are redefining thermal management for AI infrastructure—delivering scalable, efficient, and sustainable solutions that push the boundaries of what’s possible in data center cooling,” the release stated.